Y. Li, J.-C. Qian, Z.-H. Jiang, T.-H. Lo, D. Ding, T. Draher, T. Polakovic, W. Pfaff, A. Schleife, J.-M. Zuo, W.-K. Kwok, V. Novosad, and A. Hoffmann,
2022 IEEE International Electronic Devices Meeting, 14.6.1 (2022).
Materials Science & Engineering
Y. Li, J.-C. Qian, Z.-H. Jiang, T.-H. Lo, D. Ding, T. Draher, T. Polakovic, W. Pfaff, A. Schleife, J.-M. Zuo, W.-K. Kwok, V. Novosad, and A. Hoffmann,
2022 IEEE International Electronic Devices Meeting, 14.6.1 (2022).